VIA Technologies Core Module, 12 → 19V

Datasheets
Wetgeving en compliance
Conform
Land van herkomst: TW
Productomschrijving

VIA Embedded Board Accessories

Display Module that supports DVI monitor
Expansion Modules for PCI, PCIe, COM ports, and USB
Power Boards with DC-DC Converter
WLAN USB Module that supports IEEE 802.11b/g
Compatible embedded board models for each accessory

Specificaties
Kenmerk Waarde
Length 150mm
Maximum Operating Temperature +50 °C
Minimum Operating Temperature 0 °C
Width 51mm
3 op voorraad - levertijd is 2 werkdag(en).
Prijs Each
44,68
(excl. BTW)
54,06
(incl. BTW)
Aantal stuks
Per stuk
1 +
€ 44,68
Related Products
The RCM3200 RabbitCore processor module offers the features ...
Description:
The RCM3200 RabbitCore processor module offers the features and performance for embedded control systems, providing secure data communication with integrated Ethernet connectivity. The Dynamic C Integrated Development Environment (IDE) includes a full-featured C compiler, editor and in-circuit debugger. • ...
The Creator Ci40 development platform from Imagination Technologies ...
Description:
The Creator Ci40 development platform from Imagination Technologies is a high-performance, low-power microcomputer ideal for optimising IoT applications. The development kit features a cXT200 chip with a dual-core, dual-threaded MIPS CPU clocked at 550MHz.The kit comes pre-installed with OpenWrt with ...
The ultra-compact MiniCore RCM67xx is ideal for today’s ...
Description:
The ultra-compact MiniCore RCM67xx is ideal for today’s Smart Energy initiatives as well as other applications that require a cost effective web-enabled device server. The RCM67xx series provides up to 6 serial ports, configurable I/O and control features such as ...
Fanless, Intel® ATOM Compact Embedded Box IPCIntel® ATOM ...
Description:
Fanless, Intel® ATOM Compact Embedded Box IPCIntel® ATOM N270 Processor at 1.6 GHzDual display and support for wide screen with high resolutionSupports 2 GbE, 5 USB 2.0 and max to 5 COMs portsOptional WLAN and HSDPA modules for advanced in-vehicle ...