Multicore 25g Syringe Solder Paste

  • RS-stocknr. 184-9985
  • Fabrikantnummer 291264
  • Fabrikant Multicore
Datasheets
Wetgeving en compliance
Niet conform
Land van herkomst: GB
Productomschrijving

Fine Pitch Stencilling Grade

Two types of long open time SMT paste for stencilling or dispensing (with syringe). They print below 0.5mm (20 thou) pitch and meet IPC-SF-818 and Bellcore TR-NWT-0000 78 without cleaning. Approx melting point 179°C. Particle size 38-53μm.

RM89 (25g/75g Syringe)

For automatic or manual stencil printing
62/36/2% Tin/lead/silver as 90% of total mass content

Note

Store in a cool place e.g. Refrigerator.

Standards

IPC-SF-818; Bellcore TR-NWT-0000 78

Solder Paste - Leaded

Specificaties
Kenmerk Waarde
Package Type Syringe
Package Size 25g
7 op voorraad - levertijd is 1 werkdag(en) (EU-voorraad)
56 op voorraad - levertijd is 2 werkdag(en) (UK-voorraad)
Prijs Each
Was € 21,34
17,03
(excl. BTW)
20,61
(incl. BTW)
Aantal stuks
Per stuk
1 - 9
€ 17,03
10 - 19
€ 16,34
20 - 49
€ 15,84
50 +
€ 14,48
Related Products
Solder Paste no clean 63Sn/37Pb in 10cc Syringe ...
Description:
Solder Paste no clean 63Sn/37Pb in 10cc Syringe T5 mesh. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsPasses BONO test.
Solder Paste in jar 250g (T3) SAC305 no ...
Description:
Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesPrint gradeCompatible with enclosed print headsPasses BONO test @1.56%RoHS II and REACH compliant. ...
Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 Low Temperature T5 mesh ...
Description:
Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 Low Temperature T5 mesh 10cc Syringe. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsRoHS II and REACH compliant.
Solder Paste in jar 50g (T3) Sn42/Bi57.6/Ag0.4 Low ...
Description:
Solder Paste in jar 50g (T3) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesPrint gradeCompatible with enclosed print headsRoHS II and REACH ...