Thermal Interface Sheet, Hi-Flow 225F-AC, 1W/m·K, 11 x 12in 0.102mm, Self-Adhesive

  • RS-stocknr. 127-041
  • Fabrikantnummer HF225FAC-0.004-AC-1112
  • Fabrikant Bergquist
Datasheets
Wetgeving en compliance
Conform
Land van herkomst: US
Productomschrijving

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

Specificaties
Kenmerk Waarde
Dimensions 11 x 12in
Thickness 0.102mm
Length 11in
Width 12in
Thermal Conductivity 1W/m·K
Material Hi-Flow 225F-AC
Self-Adhesive Yes
Maximum Operating Temperature +120°C
Material Trade Name Hi-Flow 225F-AC
Operating Temperature Range Maximum of +120 °C
109 op voorraad - levertijd is 2 werkdag(en).
Prijs Each
64,14
(excl. BTW)
77,61
(incl. BTW)
Aantal stuks
Per stuk
1 - 24
€ 64,14
25 - 99
€ 57,71
100 - 249
€ 51,30
250 - 499
€ 48,10
500 +
€ 47,03
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