Molex, 501864 0.50 mm Pitch 50 Way Straight Connector, Surface Mount
- RS-stocknr.:
- 795-132
- Fabrikantnummer:
- 501864-5081
- Fabrikant:
- Molex
Subtotaal (1 rol van 900 eenheden)*
€ 2.884,15
(excl. BTW)
€ 3.489,82
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 06 januari 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 2.884,15 | € 3,205 |
*prijsindicatie
- RS-stocknr.:
- 795-132
- Fabrikantnummer:
- 501864-5081
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Number of Contacts | 50 | |
| Product Type | Connector | |
| Contact Material | Copper Alloy | |
| Current | 0.5A | |
| Pitch | 0.50mm | |
| Mount Type | Surface | |
| Termination Type | Surface Mount | |
| Contact Position | Bottom | |
| Orientation | Straight | |
| Locking Mechanism | Yes | |
| Voltage | 50V | |
| Minimum Operating Temperature | -40°C | |
| Series | 501864 | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL E29179 | |
| Contact Plating | Tin | |
| Housing Material | Liquid Crystal Polymer | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Number of Contacts 50 | ||
Product Type Connector | ||
Contact Material Copper Alloy | ||
Current 0.5A | ||
Pitch 0.50mm | ||
Mount Type Surface | ||
Termination Type Surface Mount | ||
Contact Position Bottom | ||
Orientation Straight | ||
Locking Mechanism Yes | ||
Voltage 50V | ||
Minimum Operating Temperature -40°C | ||
Series 501864 | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL E29179 | ||
Contact Plating Tin | ||
Housing Material Liquid Crystal Polymer | ||
- Land van herkomst:
- JP
The Molex FFC FPC to Board Connector is a Compact vertical surface mount solution designed for reliable signal transmission in high-density electronic assemblies. It features separated gold plating to enhance conductivity and ensure long-term durability in demanding environments.
Vertical design enables space saving PCB layout
Surface mount structure supports automated assembly
Gold plated contacts improve signal reliability