TE Connectivity 0.6 mm Pitch 200 Way, Right Angle Board Mount DDR2 DIMM Socket ,1.8 V, 500mA

Subtotal (1 tray of 40 units)*

€ 222,00

(exc. VAT)

€ 268,62

(inc. VAT)

Add to Basket
Select or type quantity
Bestellingen onder € 75,00 (excl. BTW) € 5,95.
Tijdelijk niet op voorraad
  • Verzending vanaf 16 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s)
Per Tray
Per unit*
1 +€ 222,00€ 5,55

*price indicative

RS Stock No.:
475-201
Distrelec Article No.:
304-59-083
Mfr. Part No.:
1473006-4
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Merk

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Orientation

Right Angle

Insertion/Removal Method

Cam-In

Contact Material

Copper Alloy

Current

500mA

Contact Plating

Gold Flash

Number of Contacts

200

Pitch

0.6mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

SDRAM Type

DDR2

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Latching

Yes

Row Spacing

6.2mm

Maximum Operating Temperature

85°C

Standards/Approvals

UL 94 V-0

Series

DDR2 SO DIMM

Voltage

1.8 V

COO (Country of Origin):
CN
The TE Connectivity double data rate (DDR) 2 socket connector is designed for high-performance memory applications, ensuring robust connectivity in compact electronic devices. With a stack height of 5.2 mm and right-angle module orientation, this socket offers optimal space efficiency, making it ideal for modern computing systems. The 200-position configuration facilitates reliable data transmission, while its adherence to industry standards guarantees compatibility with various motherboards and memory cards. This connector not only meets but exceeds expectations in temperature resistance, operating effectively within a wide temperature range. Suitable for various circuits, it empowers manufacturers to deliver innovative solutions in the realm of memory interfacing.

Optimised for double data rate applications, ensuring faster performance

Space-efficient design ideal for compact device integration

Right-angle orientation simplifies PCB layout and assembly

Designed to maintain reliability under rigorous temperature conditions

Complies with EU RoHS and other sustainability directives for responsible manufacturing

Offers reverse keying for added mating security

Constructed from high-temperature thermoplastic for enhanced durability

Utilises gold flash plating for improved conductivity and reduced insertion loss

Features a locking ejector design for secure module retention

Related links