Amphenol Communications Solutions 0.5 mm Pitch 262 Way, Right Angle Surface Mount Mount DDR5 DIMM Socket ,250 V ac,
- RS-stocknr.:
- 263-3684P
- Fabrikantnummer:
- 10157591-002RHLF
- Fabrikant:
- Amphenol Communications Solutions
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 263-3684P
- Fabrikantnummer:
- 10157591-002RHLF
- Fabrikant:
- Amphenol Communications Solutions
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Amphenol Communications Solutions | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Latched | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 262 | |
| Pitch | 0.5mm | |
| Mount Type | Surface Mount | |
| Housing Material | Liquid Crystal Polymer | |
| SDRAM Type | DDR5 | |
| Minimum Operating Temperature | -40°C | |
| Latching | Yes | |
| Maximum Operating Temperature | 85°C | |
| Maximum Contact Resistance | 1mΩ | |
| Standards/Approvals | RoHS | |
| Series | 10157591 | |
| Voltage | 250 V ac | |
| Alles selecteren | ||
|---|---|---|
Merk Amphenol Communications Solutions | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Orientation Right Angle | ||
Insertion/Removal Method Latched | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 262 | ||
Pitch 0.5mm | ||
Mount Type Surface Mount | ||
Housing Material Liquid Crystal Polymer | ||
SDRAM Type DDR5 | ||
Minimum Operating Temperature -40°C | ||
Latching Yes | ||
Maximum Operating Temperature 85°C | ||
Maximum Contact Resistance 1mΩ | ||
Standards/Approvals RoHS | ||
Series 10157591 | ||
Voltage 250 V ac | ||
- Land van herkomst:
- CN
The Amphenol DDR5 SO-DIMM connectors deliver high speed and bandwidth. Being half the size of regular DIMMs, it consume lower power and promote better thermal management.
Withstands high temperature IR flow
LCP, halogen free, housing material