Molex 21657 Series Vertical Through Hole PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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€ 8,09

(excl. BTW)

€ 9,79

(incl. BTW)

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1 - 4€ 8,09€ 1,618
5 - 9€ 7,44€ 1,488
10 +€ 6,71€ 1,342

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RS-stocknr.:
536-870
Fabrikantnummer:
2165711042
Fabrikant:
Molex
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Merk

Molex

Series

21657

Product Type

PCB Header

Current

13A

Pitch

3mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

2

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Power, Wire-to-Board

Contact Plating

Matt Tin

Contact Material

High Copper Alloy

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Contact Gender

Female

Tail Pin Length

3.18mm

Maximum Operating Temperature

125°C

Standards/Approvals

No

Land van herkomst:
CN
The Molex Micro fit+ versa Color Vertical Header is engineered for outstanding reliability and performance in a compact design. Featuring a through hole mounting style and a 3.00mm pitch, it is ideal for applications requiring efficient power and data transmission. The product is designed with two circuits in a single row, ensuring a streamlined connection in both power and wire to board configurations. With its durable liquid crystal polymer construction and matte tin plating, it promises not only electrical efficiency but also environmental compliance through its low halogen and RoHS compliant features. This component is perfect for modern electronic devices where space and efficiency are paramount, providing enhanced conductivity and durability under a wide temperature range.

Vertical orientation allows for optimal space utilisation in circuit designs

Glow wire capability enhances safety by preventing ignition under heat

PCB retention offers secure mounting which ensuring device stability

Durable 94V 0 rated flammability provides reliable operation

The micro fit design facilitates seamless mating with minimal effort

CSA and UL certifications affirm high standard compliance and safety

Compact dimensions cater to space constrained applications

High copper alloy metal material ensures superior conductivity

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