Samtec ERF8 Series Vertical Surface PCB Socket, 70-Contact, 2 Row, 1.27 mm Pitch Solder
- RS-stocknr.:
- 224-7969
- Fabrikantnummer:
- ERF8-035-05.0-L-DV-K-TR
- Fabrikant:
- Samtec
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 224-7969
- Fabrikantnummer:
- ERF8-035-05.0-L-DV-K-TR
- Fabrikant:
- Samtec
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Samtec | |
| Number of Contacts | 70 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Board-to-Board | |
| Pitch | 1.27mm | |
| Current | 2.2A | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 18mm | |
| Voltage | 318 V | |
| Series | ERF8 | |
| Row Pitch | 4.5mm | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk Samtec | ||
Number of Contacts 70 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Board-to-Board | ||
Pitch 1.27mm | ||
Current 2.2A | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 18mm | ||
Voltage 318 V | ||
Series ERF8 | ||
Row Pitch 4.5mm | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec ERF8-S is 0.80 mm edge rate rugged high speed socket and a shielded board-mount socket designed for use in high-speed systems. The ERF8-S uses the edge rate and 60 number of position contact system which is designed for applications requiring high-mating cycles and 56Gbps PAM4 performance. The ERF8-S mates with ERM8-S board-mounted headers.
360º metal shielding for reduced EMI
Available with extended guide post
56 Gbps PAM4 performance
Rugged Edge Rate contacts optimized for signal integrity performance
1.5 mm contact wipe
Positions: 20 - 60
Stack Height: 7, 9, 12 and 16 mm
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- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder