Samtec CLP Series Horizontal Surface PCB Socket, 28-Contact, 2 Row, 1.27 mm Pitch Solder
- RS-stocknr.:
- 227-1073
- Fabrikantnummer:
- CLP-114-02-G-D-BE-P-TR
- Fabrikant:
- Samtec
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 6,26
(excl. BTW)
€ 7,57
(incl. BTW)
Voeg 14 eenheden toe voor gratis bezorging
Tijdelijk niet op voorraad
- Verzending vanaf 19 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 - 9 | € 6,26 |
| 10 - 24 | € 5,70 |
| 25 - 49 | € 5,21 |
| 50 - 99 | € 4,83 |
| 100 + | € 4,47 |
*prijsindicatie
- RS-stocknr.:
- 227-1073
- Fabrikantnummer:
- CLP-114-02-G-D-BE-P-TR
- Fabrikant:
- Samtec
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Samtec | |
| Number of Contacts | 28 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Current | 3.4A | |
| Pitch | 1.27mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| Alles selecteren | ||
|---|---|---|
Merk Samtec | ||
Number of Contacts 28 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Current 3.4A | ||
Pitch 1.27mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Maximum Operating Temperature 125°C | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 14 positions and surface mount lead style. It has 0.000254mm gold in contact area and 0.0000762mm on tail.
Dual row
Bottom entry style
Alignment pins
Polyimide film pick & place pad
Tape and reel packaging
Gerelateerde Links
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Surface Mount
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder