TE Connectivity, Z-PACK 1.9 mm Pitch High Speed High Speed Backplane Connector, Vertical Male, 10 Column, 12 Row, 90 Way

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We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
RS-stocknr.:
501-296
Fabrikantnummer:
1934341-1
Fabrikant:
TE Connectivity
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TE Connectivity

Backplane Connector Type

High Speed

Product Type

High Speed Backplane Connector

Number of Contacts

90

Current

0.5A

Number of Columns

10

Orientation

Vertical

Number of Rows

12

Voltage

250V

Connector Gender

Male

Housing Material

Liquid Crystal Polymer

Pitch

1.9mm

Contact Material

Phosphor Bronze

Mount Type

Board

Contact Plating

Gold

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

90°C

Contact Gender

Male

Standards/Approvals

No

Series

Z-PACK

Land van herkomst:
CN
The TE Connectivity 90 Position High Speed Backplane Connector redefines connectivity with its innovative design, ensuring exceptional performance in demanding applications. Engineered for high-speed backplane connections, this connector features a vertical PCB mount header, boasting 9 rows and 10 columns for a robust, space-efficient solution. Its partially shrouded construction not only enhances signal integrity but also provides reliable protection against external interference. With a focus on durability, the connector is crafted from liquid crystal polymer, enabling operation within a wide temperature range while meeting rigorous industry standards. This product epitomises high-speed connectivity for various circuit applications, making it indispensable for modern electronic systems that demand reliability and efficiency.

Delivers superior data rates of up to 10 Gb/s

Boasts a differential impedance of 100 Ω, ideal for high-speed applications

Facilitates easy alignment during installation with guide slot mating features

Designed with a matte finish for improved contact reliability

Incorporates compliant tail technology for enhanced PCB retention

Employs a through-hole press-fit termination method for secure connections

Features a compact footprint, supporting 90 positions in a dense array

Compatible with various board types, ensuring versatility

Low halogen content emphasises eco-friendliness and regulatory compliance

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