Molex, 171292 1.9 mm Pitch Connector Backplane Connector, Vertical, 6 Column, 9 Row, 54 Way

Subtotaal (1 tray van 30 eenheden)*

€ 249,14

(excl. BTW)

€ 301,46

(incl. BTW)

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  • Klaar voor verzending vanaf 14 september 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 249,14€ 8,305

*prijsindicatie

RS-stocknr.:
684-914
Fabrikantnummer:
171292-1328
Fabrikant:
Molex
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Merk

Molex

Backplane Connector Type

Connector

Product Type

Backplane Connector

Number of Contacts

54

Current

750mA

Number of Columns

6

Orientation

Vertical

Number of Rows

9

Voltage

30V

Pitch

1.9mm

Contact Plating

Gold over Tin

Minimum Operating Temperature

-55°C

Termination Type

Solder

Maximum Operating Temperature

85°C

Standards/Approvals

RoHS, REACH

Series

171292

Land van herkomst:
SG
The Molex Impact 100 Ohm 3 Pair Vertical Backplane Header is engineered for robust connectivity in high-performance applications. Designed with 54 circuits and arranged in six columns, it ensures reliable data transmission at a maximum data rate of 25.0 Gbps. This unguided header accommodates a pin length of 5.50mm and features high-quality plating with matte tin and gold, enhancing durability and electrical performance. The component is compliant with various environmental regulations, making it a reliable choice for modern electronic assemblies, while its vertical orientation simplifies integration into space-constrained designs. With a wide operating temperature range from -55°C to +85°C, this product is adept at handling diverse operating conditions.

Active status ensures up to date usability

Designed for conventional applications, facilitating ease of use

High performance alloy construction guarantees durability and reliability

Features a black resin colour for aesthetic and functional benefits

Capable of 200 mating cycles to withstand frequent connections

Terminated through hole style supports various PCB designs

Compatible with GbX Backplane Guide Pins for optimal alignment

Low halogen compliance promotes safer environmental practices

Effective for high speed data transfer and connections in critical applications

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