Vero Technologies 96 Way Backplane Epoxy Glass Fabric Laminate 2 84 HP With 15.24 mm Connector Pitch

RS-stocknr.:: 435-068
Fabrikantnummer:: 222-2470
Fabrikant:: Vero Technologies

Vero Technologies 96 Way Backplane Epoxy Glass Fabric Laminate 2 84 HP With 15.24 mm Connector Pitch

Bulkkorting beschikbaar

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Subtotaal (1 eenheid)*

€ 258,80

(excl. BTW)

€ 313,15

(incl. BTW)

GRATIS bezorging voor bestellingen van meer dan € 90,00

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Aantal stuks	Per stuk
1 - 4	€ 258,80
5 - 9	€ 245,86
10 - 49	€ 232,91
50 +	€ 219,98

*prijsindicatie

RS-stocknr.:: 435-068
Fabrikantnummer:: 222-2470
Fabrikant:: Vero Technologies

Specificaties

Datasheets

Wetgeving en compliance

Productomschrijving

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Alles selecteren	Attribuut	Waarde
	Merk	Vero Technologies
	Product Type	Backplane
	Number of Contacts	96
	Sub Type	Microbus Backplanes
	Board Material	Epoxy Glass Fabric Laminate
	Number of Sides	2
	Horizontal Pitch	84HP
	Pitch	15.24mm
	Copper Thickness	35μm
	External Width	20mm
	Board Thickness	1.6mm
	External Height	130mm
	Standards/Approvals	RoHS, EP-GC-Cu3 FR4, BS 4584

	Alles selecteren
	Merk Vero Technologies
	Product Type Backplane
	Number of Contacts 96
	Sub Type Microbus Backplanes
	Board Material Epoxy Glass Fabric Laminate
	Number of Sides 2
	Horizontal Pitch 84HP
	Pitch 15.24mm
	Copper Thickness 35μm
	External Width 20mm
	Board Thickness 1.6mm
	External Height 130mm
	Standards/Approvals RoHS, EP-GC-Cu3 FR4, BS 4584

Datasheet - 222-2470

Land van herkomst:: GB

Eurocard Backplanes, Double-Sided

Double sided backplanes 3U high with pth for high reliability which will accept DIN41612 connectors. Suitable for use with subracks to IEC297-3.

96//96-way suitable for high speed logic systems where screening is required between each signal line. Can also be used for slower applications with a maximum of 84 seperate signal lines by breaking the 0V commoning line in the end position

PC / VME Bus Boards

PC Compatible Prototyping Boards

Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m² (1 oz/ft²). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix.

Microboard Pattern

Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.