Nexperia BC847AQCZ Transistor, 100 mA NPN, 45 V, 3-Pin SOT-8009
- RS-stocknr.:
- 240-1792
- Fabrikantnummer:
- BC847AQCZ
- Fabrikant:
- Nexperia
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 240-1792
- Fabrikantnummer:
- BC847AQCZ
- Fabrikant:
- Nexperia
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Nexperia | |
| Product Type | Transistor | |
| Maximum DC Collector Current Idc | 100mA | |
| Maximum Collector Emitter Voltage Vceo | 45V | |
| Package Type | SOT-8009 | |
| Mount Type | Surface | |
| Maximum Collector Base Voltage VCBO | 50V | |
| Transistor Polarity | NPN | |
| Minimum DC Current Gain hFE | 220 | |
| Maximum Emitter Base Voltage VEBO | 6V | |
| Minimum Operating Temperature | -50°C | |
| Maximum Power Dissipation Pd | 450mW | |
| Maximum Operating Temperature | 150°C | |
| Pin Count | 3 | |
| Standards/Approvals | RoHS | |
| Height | 2.9mm | |
| Length | 1.3mm | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Nexperia | ||
Product Type Transistor | ||
Maximum DC Collector Current Idc 100mA | ||
Maximum Collector Emitter Voltage Vceo 45V | ||
Package Type SOT-8009 | ||
Mount Type Surface | ||
Maximum Collector Base Voltage VCBO 50V | ||
Transistor Polarity NPN | ||
Minimum DC Current Gain hFE 220 | ||
Maximum Emitter Base Voltage VEBO 6V | ||
Minimum Operating Temperature -50°C | ||
Maximum Power Dissipation Pd 450mW | ||
Maximum Operating Temperature 150°C | ||
Pin Count 3 | ||
Standards/Approvals RoHS | ||
Height 2.9mm | ||
Length 1.3mm | ||
Automotive Standard No | ||
The Nexperia NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
High power dissipation capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
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