Nexperia BC856BQCZ Bipolar Transistor, -100 mA PNP, -65 V, 3-Pin SOT-8009
- RS-stocknr.:
- 240-1805
- Fabrikantnummer:
- BC856BQCZ
- Fabrikant:
- Nexperia
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 240-1805
- Fabrikantnummer:
- BC856BQCZ
- Fabrikant:
- Nexperia
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Nexperia | |
| Product Type | Bipolar Transistor | |
| Maximum DC Collector Current Idc | -100mA | |
| Maximum Collector Emitter Voltage Vceo | -65V | |
| Package Type | SOT-8009 | |
| Mount Type | Surface | |
| Transistor Configuration | PNP | |
| Maximum Collector Base Voltage VCBO | -80V | |
| Minimum DC Current Gain hFE | 220 | |
| Transistor Polarity | PNP | |
| Maximum Emitter Base Voltage VEBO | -6V | |
| Minimum Operating Temperature | -55°C | |
| Pin Count | 3 | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | RoHS | |
| Series | BC856xQC | |
| Automotive Standard | AEC-Q101 | |
| Alles selecteren | ||
|---|---|---|
Merk Nexperia | ||
Product Type Bipolar Transistor | ||
Maximum DC Collector Current Idc -100mA | ||
Maximum Collector Emitter Voltage Vceo -65V | ||
Package Type SOT-8009 | ||
Mount Type Surface | ||
Transistor Configuration PNP | ||
Maximum Collector Base Voltage VCBO -80V | ||
Minimum DC Current Gain hFE 220 | ||
Transistor Polarity PNP | ||
Maximum Emitter Base Voltage VEBO -6V | ||
Minimum Operating Temperature -55°C | ||
Pin Count 3 | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals RoHS | ||
Series BC856xQC | ||
Automotive Standard AEC-Q101 | ||
The Nexperia PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
High power dissipation capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
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