TE Connectivity AMP-IN Series Female Crimp Contact, 12 AWG Min Solder, 12 AWG Max

Subtotaal (1 rol van 3000 eenheden)*

€ 333,00

(excl. BTW)

€ 402,93

(incl. BTW)

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  • Klaar voor verzending vanaf 01 januari 2027
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Rol(len)
Per rol
Per stuk*
1 +€ 333,00€ 0,111

*prijsindicatie

RS-stocknr.:
479-898
Artikelnummer Distrelec:
304-61-431
Fabrikantnummer:
3-794013-1
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Gender

Female

Product Type

Crimp Contact

For Use With

Wire & Cable

Series

AMP-IN

Contact Plating

Tin Plated

Minimum Wire Size AWG

12AWG

Maximum Wire Size AWG

12AWG

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU

Land van herkomst:
CN
The TE Connectivity High-performance PCB pin terminal is designed for seamless integration into various electronic applications. Optimised for use with 12 AWG wires, it facilitates reliable soldering through-hole technology, ensuring a robust connection. The terminal boasts a tin-plated finish for enhanced conductivity and reliability, while its compact design is suitable for diverse PCB thicknesses. With a recommended PCB thickness of 1.57 mm, this terminal not only meets industry standards but also offers exceptional performance in demanding environments. Its versatility makes it ideal for terminating wire and cable connections, making it a preferred choice in modern electronic assemblies.

Designed for efficient soldering in space-constrained applications

Features a miniature terminal size for streamlined installations

Constructed with bright tin plating to ensure optimal electrical conductivity

Supports a wide range of compatible insulation diameters for flexibility

Operates reliably in extreme temperature conditions, ranging from -40 to 105 °C

Presented in packaging quantities of 3000 for large scale manufacturing needs

Low halogen content makes it an environmentally friendly choice

Wave solder capability allows for high-throughput assembly processes

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