Eaton xEnergy Basic BPM-O-800/7-P Distribution Board Enclosure

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Subtotaal (1 eenheid)*

€ 898,00

(excl. BTW)

€ 1.086,58

(incl. BTW)

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  • Verzending vanaf 27 april 2026
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Aantal stuks
Per stuk
1 +€ 898,00

*prijsindicatie

RS-stocknr.:
230-234
Fabrikantnummer:
116664 BPM-O-800/7-P
Fabrikant:
Eaton
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Merk

Eaton

Product Type

Distribution Board Enclosure

Range

xEnergy Basic

Series

BPM-O-800/7-P

Colour

Grey

Mount Type

Surface

External Depth

300mm

Supply Voltage

440 V

IP Rating

IP55

Material

Sheet Steel

External Height

790mm

External Width

830mm

Number of Rows

4

Standards/Approvals

RoHS

Land van herkomst:
CZ
The Eaton xEnergy Basic low voltage switchgear is designed for robust surface-mount installation, offering an effective solution for electrical distribution needs. With an IP55 rating, this distribution board excels in moisture-proof applications, ensuring safety and reliability in challenging environments. Its compact dimensions make it adaptable for various installations, while the rotary lever door style allows for easy access. Engineered for thermal stability, the product provides reliable heat dissipation, making it suitable for high-demand scenarios. The essential features are complemented by compliance with industry standards, assuring customers of its quality and performance. Whether for residential or commercial use, this solution delivers excellent protection and functionality, designed with user requirements at the forefront.

Moisture-proof design enhances reliability in diverse conditions

Rotary lever door facilitates convenient access to the enclosure

Compact dimensions fit well in limited spaces, offering flexibility

Engineered for thermal stability ensures efficient operation under load

IP55 rating protects against dust and water ingress, ensuring longevity

Robust compliance with industry standards assures peace of mind

Constructed from durable sheet steel for enhanced strength and longevity

Designed for easy surface mounting, simplifying installation

Ample modular spacing increases expandability for future needs

Enhanced heat dissipation supports high-performance applications

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