Samtec MECT Series Right Angle Edge Connector, Surface, 20-Contacts, 0.8 mm Pitch, 2 Row, Solder

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RS-stocknr.:
159-981
Fabrikantnummer:
MECT-110-01-M-D-RA1
Fabrikant:
Samtec
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Merk

Samtec

Product Type

Edge Connector

Orientation

Right Angle

Current

2A

Number of Contacts

20

Number of Rows

2

Pitch

0.8mm

Mount Type

Surface

Contact Plating

Gold over Nickel

Contact Material

Phosphor Bronze

Card Thickness

1mm

Termination Type

Solder

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

125°C

Voltage

265V ac

Standards/Approvals

No

Housing Material

Liquid Crystal Polymer

Series

MECT

Card Type

Edge

Samtec Edge Connector, Solder Termination Method, Dual-Row - MECT Series - MECT-110-01-M-D-RA1


Want to extend the reach of your PCB? Grab this 0.8mm pitch edge connector from Samtec to create a connection point for extension cards. Thanks to its 20 contacts, the unit channels multiple circuits to streamline your electronic setup. For versatility, this SFP interface supports Gigabit Ethernet, Fibre Channel and other communication protocols. As its LCP housing insulates the live components, you can hot-swap parts without any risk of an electric shock. Measuring only 11 (L) x 5.2 (W) x 7.4mm (D), it fits into most small-sized enclosures.

Features & Benefits


• Mates with SFP, XFP and XENPAK transceivers for flexible use

• Performs glitch-free in temperatures as low as -55°C and as high as +125°C

• Highly conductive phosphor bronze contacts reliably zip signals between components

Applications


• Computer assemblies

• Telecommunications networks

• Aerospace systems

• Test and measuring instruments

How do I install this edge connector?


Installation is a breeze, as you simply solder the unit onto the edge of your PCB. The metallic tracks on the rim mate with the contacts to provide an electrical connection.

What's the voltage rating of this part?


This edge connector has a voltage rating of 265V AC, so it's built for medium-voltage electrical setups.

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