Molex 76291 Series Straight Edge Connector, Through Hole, 68-Contacts, 0.75 mm Pitch, Through Hole

Subtotaal (1 tray van 10 eenheden)*

€ 246,20

(excl. BTW)

€ 297,90

(incl. BTW)

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  • Klaar voor verzending vanaf 05 november 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 246,20€ 24,62

*prijsindicatie

RS-stocknr.:
691-571
Fabrikantnummer:
76291-0068
Fabrikant:
Molex
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Merk

Molex

Product Type

Edge Connector

Orientation

Straight

Current

1.5A

Number of Contacts

68

Pitch

0.75mm

Mount Type

Through Hole

Contact Plating

Gold

Contact Material

Copper Alloy

Card Thickness

1.57mm

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Voltage

50V

Standards/Approvals

RoHS

Housing Material

High Temperature Thermoplastic

Series

76291

Land van herkomst:
CN
The Molex Edgeline CoPlanar Connector is engineered for high-performance applications requiring reliable connectivity with an array of 68 circuits. This robust connector supports data rates from 5.0 to 12.0 Gbps, optimally designed for a PCB thickness of 1.57mm. With a Compact 0.75mm pitch, it ensures seamless integration into space-constrained environments while maintaining exceptional signal integrity. The connector's Active status and compliance with leading industry standards underline its efficiency and commitment to quality. Additionally, it features a mating durability of up to 200 cycles and is suitable for various operating conditions, ranging from -40°C to +85°C, making it a versatile choice for numerous electronic applications.

68 circuits ensure extensive connectivity options for complex applications

Supports a wide data rate range from 5.0 to 12.0 Gbps for versatile performance

Designed for PCB thickness of 1.57mm, optimising space usage in Compact designs

Operates effectively within a temperature range of -40°C to +85°C for diverse environmental needs

Low-halogen materials contribute to environmental safety and compliance

High-temperature thermoplastic resin ensures durability under demanding conditions

Gold mating and tin termination plating maximise connectivity integrity

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