TE Connectivity T81 Series Electromechanical Interface Relay, PCB Mount, 5V Coil, SPDT
- RS-stocknr.:
- 520-536
- Fabrikantnummer:
- 5-1393779-5
- Fabrikant:
- TE Connectivity
Subtotaal (1 verpakking van 100 eenheden)*
€ 211,44
(excl. BTW)
€ 255,84
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 13 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 211,44 | € 2,114 |
*prijsindicatie
- RS-stocknr.:
- 520-536
- Fabrikantnummer:
- 5-1393779-5
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Coil Voltage | 5V | |
| Contact Configuration | SPDT | |
| Mounting Type | PCB Mount | |
| Series | T81 | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Coil Voltage 5V | ||
Contact Configuration SPDT | ||
Mounting Type PCB Mount | ||
Series T81 | ||
- Land van herkomst:
- CN
The TE Connectivity ultraminiature high-density PC board relay exemplifies precision and performance in compact form. Designed for demanding applications, it boasts a robust construction that ensures reliability under varying operational conditions. With its advanced solder process capability, this relay meets the stringent requirements of modern electronic systems, making it an ideal choice for professionals seeking efficiency without compromising on quality. Its compliance with numerous European directives underscores its commitment to sustainability and safety, ensuring that it meets the latest standards for environmental-friendliness. Whether used in general-purpose applications or specialised settings, this relay delivers the robust performance necessary for todays innovative technologies.
Compact design allows for easy integration into space-constrained environments
Durable materials enhance longevity and minimise maintenance costs
High solder process capability supports encapsulation in various applications
Strict compliance with EU RoHS and REACH regulations ensures environmental safety
Broad compatibility with different electronic configurations increases versatility
Optimised for reliable performance under diverse operational conditions
Durable materials enhance longevity and minimise maintenance costs
High solder process capability supports encapsulation in various applications
Strict compliance with EU RoHS and REACH regulations ensures environmental safety
Broad compatibility with different electronic configurations increases versatility
Optimised for reliable performance under diverse operational conditions
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