Alliance Memory NAND 10 GB Flash Memory FBGA, ASFC10G31P3-51BIN
- RS-stocknr.:
- 338-523
- Fabrikantnummer:
- ASFC10G31P3-51BIN
- Fabrikant:
- Alliance Memory
Subtotaal (1 tray van 1520 eenheden)*
€ 16.653,12
(excl. BTW)
€ 20.150,64
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 18 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per tray* |
|---|---|---|
| 1520 + | € 10,956 | € 16.653,12 |
*prijsindicatie
- RS-stocknr.:
- 338-523
- Fabrikantnummer:
- ASFC10G31P3-51BIN
- Fabrikant:
- Alliance Memory
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Alliance Memory | |
| Product Type | Flash Memory | |
| Memory Size | 10GB | |
| Package Type | FBGA | |
| Maximum Clock Frequency | 200MHz | |
| Cell Type | NAND | |
| Minimum Supply Voltage | 2.7V | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS Compliant | |
| Height | 1mm | |
| Length | 13mm | |
| Width | 11.5 mm | |
| Supply Current | 132mA | |
| Automotive Standard | No | |
| Series | ASFC 3D pSLC | |
| Alles selecteren | ||
|---|---|---|
Merk Alliance Memory | ||
Product Type Flash Memory | ||
Memory Size 10GB | ||
Package Type FBGA | ||
Maximum Clock Frequency 200MHz | ||
Cell Type NAND | ||
Minimum Supply Voltage 2.7V | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS Compliant | ||
Height 1mm | ||
Length 13mm | ||
Width 11.5 mm | ||
Supply Current 132mA | ||
Automotive Standard No | ||
Series ASFC 3D pSLC | ||
- Land van herkomst:
- DE
The Alliance Memory e-MMC is a managed non-volatile storage consisting of a single chip MMC controller and a NAND flash memory chip inside a JEDEC defined standard BGA package. It is specially designed as a small form factor memory product for storage of data and as a boot media. The performance is optimized to a mostly read operation mode at low power consumption. The utilization of 3D pSLC NAND technology targets higher demanding and write intensive industrial applications, which is supported by the industrial temperature grade specification. The e-MMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing. The 3D PSLC firmware features support high throughput for large data transfers and performance for small random data more commonly found in code usage. It also contains several security features as well as multiple boot partitions. Uses advanced refresh features for retention optimization for read intensive applications.
Capacities 10G
Fully compliant with JEDEC eMMC 5.1 Standard JESD84-B51
153-ball BGA 0.5mm pitch 11.5 x 13mm RoHS compliant
3D TLC NAND base technology in Enhanced Mode pSLC
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