Molex, 501786 0.5 mm Pitch 30 Way Vertical FPC Connector, Surface Mount
- RS-stocknr.:
- 691-488
- Fabrikantnummer:
- 501786-3092
- Fabrikant:
- Molex
Subtotaal (1 rol van 900 eenheden)*
€ 1.805,27
(excl. BTW)
€ 2.184,38
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 25 september 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 1.805,27 | € 2,006 |
*prijsindicatie
- RS-stocknr.:
- 691-488
- Fabrikantnummer:
- 501786-3092
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Number of Contacts | 30 | |
| Product Type | FPC Connector | |
| Contact Material | Copper Alloy | |
| Pitch | 0.5mm | |
| Current | 500mA | |
| Mount Type | Surface | |
| Termination Type | Surface Mount | |
| Orientation | Vertical | |
| Voltage | 50V | |
| Minimum Operating Temperature | -40°C | |
| Series | 501786 | |
| Maximum Operating Temperature | 105°C | |
| Number of Rows | 1 | |
| Standards/Approvals | RoHS Compliant | |
| Contact Plating | Gold | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Number of Contacts 30 | ||
Product Type FPC Connector | ||
Contact Material Copper Alloy | ||
Pitch 0.5mm | ||
Current 500mA | ||
Mount Type Surface | ||
Termination Type Surface Mount | ||
Orientation Vertical | ||
Voltage 50V | ||
Minimum Operating Temperature -40°C | ||
Series 501786 | ||
Maximum Operating Temperature 105°C | ||
Number of Rows 1 | ||
Standards/Approvals RoHS Compliant | ||
Contact Plating Gold | ||
- Land van herkomst:
- JP
The Molex 0.50mm pitch Easy-On FFC or FPC-to-board connector features a vertical surface mount receptacle housing assembly without grounding terminals, includes separated gold plating for enhanced conductivity and durability, and supports 30 circuits for high-density interconnect applications.
Metal material used is copper alloy
Mating surface is plated with gold
Termination surface is plated with gold
Resin material used is liquid crystal polymer