Molex, 54550 0.5 mm Pitch 4 Way Right Angle FPC Connector, Surface Mount
- RS-stocknr.:
- 795-600
- Fabrikantnummer:
- 54550-0471
- Fabrikant:
- Molex
Subtotaal (1 rol van 3000 eenheden)*
€ 2.507,95
(excl. BTW)
€ 3.034,62
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 24 december 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Rol(len) | Per rol | Per stuk* |
|---|---|---|
| 1 + | € 2.507,95 | € 0,836 |
*prijsindicatie
- RS-stocknr.:
- 795-600
- Fabrikantnummer:
- 54550-0471
- Fabrikant:
- Molex
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Molex | |
| Number of Contacts | 4 | |
| Product Type | FPC Connector | |
| Contact Material | Phosphor Bronze | |
| Sub Type | Slider Pad | |
| Current | 0.5A | |
| Pitch | 0.5mm | |
| Mount Type | Surface | |
| Termination Type | Surface Mount | |
| Contact Position | Top | |
| Orientation | Right Angle | |
| Voltage | 50V | |
| Minimum Operating Temperature | -40°C | |
| Series | 54550 | |
| Maximum Operating Temperature | 85°C | |
| Number of Rows | 1 | |
| Standards/Approvals | UL | |
| Contact Plating | Tin | |
| Housing Material | Liquid Crystal Polymer | |
| Alles selecteren | ||
|---|---|---|
Merk Molex | ||
Number of Contacts 4 | ||
Product Type FPC Connector | ||
Contact Material Phosphor Bronze | ||
Sub Type Slider Pad | ||
Current 0.5A | ||
Pitch 0.5mm | ||
Mount Type Surface | ||
Termination Type Surface Mount | ||
Contact Position Top | ||
Orientation Right Angle | ||
Voltage 50V | ||
Minimum Operating Temperature -40°C | ||
Series 54550 | ||
Maximum Operating Temperature 85°C | ||
Number of Rows 1 | ||
Standards/Approvals UL | ||
Contact Plating Tin | ||
Housing Material Liquid Crystal Polymer | ||
- Land van herkomst:
- CN
The Molex connector series offers a reliable solution is designed for circuit connectivity. Its Compact structure facilitates efficient integration into various applications, ensuring stable performance in demanding environments.
Recommended base film thickness of 25μm enhances durability
Utilises soft copper foil of 35μm or 50μm for superior conductivity
Meets ELV and RoHS compliance standards for environmental safety
Features thermosetting adhesive for robust bonding performance
Designed for optimal performance in FPC/FFC applications