Trenz Electronic GmbH TE0865-02-DGE93MA ULTRASOM+MPSOC Module Module AMD Zynq UltraScale+ ZU19EG for Trenz Electronic 6
- RS-stocknr.:
- 907-779
- Fabrikantnummer:
- TE0865-02-DGE93MA
- Fabrikant:
- Trenz Electronic GmbH
Subtotaal (1 eenheid)*
€ 6.659,33
(excl. BTW)
€ 8.057,79
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Nieuw product (vandaag reserveren)
- Verzending vanaf 23 december 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 6.659,33 |
*prijsindicatie
- RS-stocknr.:
- 907-779
- Fabrikantnummer:
- TE0865-02-DGE93MA
- Fabrikant:
- Trenz Electronic GmbH
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Trenz Electronic GmbH | |
| Programmable Logic Technology | FPGA | |
| Product Type | SoC | |
| Kit Classification | Module | |
| For Use With | Trenz Electronic 6 x 9 cm baseboards | |
| Featured Device | AMD Zynq UltraScale+ ZU19EG | |
| Kit Name | ULTRASOM+MPSOC Module | |
| Standards/Approvals | RoHS Compliant | |
| Alles selecteren | ||
|---|---|---|
Merk Trenz Electronic GmbH | ||
Programmable Logic Technology FPGA | ||
Product Type SoC | ||
Kit Classification Module | ||
For Use With Trenz Electronic 6 x 9 cm baseboards | ||
Featured Device AMD Zynq UltraScale+ ZU19EG | ||
Kit Name ULTRASOM+MPSOC Module | ||
Standards/Approvals RoHS Compliant | ||
- Land van herkomst:
- DE
The Trenz Electronic GmbH High-performance module integrates Advanced MPSoC technology, offering seamless connectivity and substantial computational power for complex applications, ensuring efficient performance within Compact designs.
Equipped with a Xilinx Zynq UltraScale+ ZU17EG, providing high computing capability
Supports up to 8 GByte DDR4 SDRAM with ECC for reliable data integrity
Features dual QSPI Flash memory for flexible configuration options
Includes comprehensive I/O interfaces for extensive connectivity solutions
