Transcend TS1TMTE370T 2230-S3-M 1 TB Internal SSD
- RS-stocknr.:
- 175-421
- Fabrikantnummer:
- TS1TMTE370T
- Fabrikant:
- Transcend
Tekort aan voorraad
Vanwege een wereldwijd voorraadtekort, weten we niet wanneer dit weer voorradig zal zijn.
- RS-stocknr.:
- 175-421
- Fabrikantnummer:
- TS1TMTE370T
- Fabrikant:
- Transcend
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Transcend | |
| Sub Type | SSD | |
| Model Number | TS1TMTE370T | |
| Memory Size | 1TB | |
| Product Type | SSD | |
| Internal/External | Internal | |
| Industrial Grade | Yes | |
| Form Factor | 2230-S3-M | |
| NAND Type | 3D TLC | |
| Interface Type | PCIe Gen 3.0 x4 NVMe | |
| Encryption Level | AES | |
| Maximum Operating Temperature | 75°C | |
| Minimum Operating Temperature | -20°C | |
| Height | 2.38mm | |
| Length | 30mm | |
| Width | 22mm | |
| Standards/Approvals | BSMI, CE, FCC, RoHS, UKCA | |
| Alles selecteren | ||
|---|---|---|
Merk Transcend | ||
Sub Type SSD | ||
Model Number TS1TMTE370T | ||
Memory Size 1TB | ||
Product Type SSD | ||
Internal/External Internal | ||
Industrial Grade Yes | ||
Form Factor 2230-S3-M | ||
NAND Type 3D TLC | ||
Interface Type PCIe Gen 3.0 x4 NVMe | ||
Encryption Level AES | ||
Maximum Operating Temperature 75°C | ||
Minimum Operating Temperature -20°C | ||
Height 2.38mm | ||
Length 30mm | ||
Width 22mm | ||
Standards/Approvals BSMI, CE, FCC, RoHS, UKCA | ||
- Land van herkomst:
- TW
Transcend SSD, 1TB Memory Size, PCIe Gen 3.0 x4 NVMe Interface Type - TS1TMTE370T
This SSD is an internal NVMe storage device designed for embedded and industrial environments, delivering high-capacity solid-state storage over a PCIe Gen3 x4 link. It operates across a broad temperature range and implements hardware-level encryption to protect stored data while fitting Compact system designs.
Features and Benefits:
• 1TB capacity provides large local data storage
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
Applications
• Suitable for industrial embedded controllers requiring local storage
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
What temperature extremes can it tolerate in operation?
It functions across an operating range from -20°C to 75°C, supporting deployment in hot and cold environments.
What form factor is required for installation in Compact systems?
The drive uses the 2230-S3-M form factor, compatible with systems accepting 2230 M.2 modules.
Which NAND technology does the device use and why does that matter?
It employs 3D TLC memory, which provides a balance between storage density and write endurance suited to many industrial workloads.
What connectivity standard must a host support for full performance?
The host must provide a PCIe Gen3 x4 NVMe Interface to achieve the intended data throughput.
Which certifications indicate suitability for regulated markets?
The unit holds BSMI, CE, FCC and RoHS approvals along with UKCA marking for applicable jurisdictions.
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