Transcend M.2 512 GB Internal SSD
- RS-stocknr.:
- 682-758
- Fabrikantnummer:
- TS512GMTE460TI-VS1
- Fabrikant:
- Transcend
Subtotaal (1 eenheid)*
€ 534,16
(excl. BTW)
€ 646,33
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tekort aan aanbod
- Plus verzending 2 stuk(s) vanaf 14 september 2026
Onze huidige voorraad is beperkt en onze leveranciers verwachten tekorten.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 534,16 |
*prijsindicatie
- RS-stocknr.:
- 682-758
- Fabrikantnummer:
- TS512GMTE460TI-VS1
- Fabrikant:
- Transcend
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Transcend | |
| Memory Size | 512GB | |
| Product Type | SSD | |
| Sub Type | SSD | |
| Internal/External | Internal | |
| Form Factor | M.2 | |
| Industrial Grade | Yes | |
| NAND Type | 3D | |
| Interface Type | NVMe PCIe Gen 3 x2 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Width | 22mm | |
| Standards/Approvals | UKCA | |
| Length | 42mm | |
| Height | 3.58mm | |
| Alles selecteren | ||
|---|---|---|
Merk Transcend | ||
Memory Size 512GB | ||
Product Type SSD | ||
Sub Type SSD | ||
Internal/External Internal | ||
Form Factor M.2 | ||
Industrial Grade Yes | ||
NAND Type 3D | ||
Interface Type NVMe PCIe Gen 3 x2 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Width 22mm | ||
Standards/Approvals UKCA | ||
Length 42mm | ||
Height 3.58mm | ||
- Land van herkomst:
- TW
Transcend SSD, 512GB Capacity, M.2 Form Factor - TS512GMTE460TI-VS1
This solid-state drive provides compact, high-capacity NVMe storage for embedded and industrial systems. Designed for internal deployment in space-constrained devices, it connects via a PCIe Gen3 x2 Interface and delivers non-volatile flash memory suitable for applications operating across a wide thermal range. The product is UKCA certified for use in regulated markets.
Features and Benefits:
• 512GB capacity offers ample storage for data logging
• NVMe PCIe Gen3 x2 Interface reduces latency and improves throughput
• 3D NAND provides dense, reliable flash memory cells
• Industrial-grade construction tolerates harsh operating conditions
• Operating range from -40 to 85°C maintains function in extremes
• Low-profile 3.58mm height fits slim system assemblies
• NVMe PCIe Gen3 x2 Interface reduces latency and improves throughput
• 3D NAND provides dense, reliable flash memory cells
• Industrial-grade construction tolerates harsh operating conditions
• Operating range from -40 to 85°C maintains function in extremes
• Low-profile 3.58mm height fits slim system assemblies
Applications
• Suitable for industrial automation controllers requiring onboard storage
• Ideal for edge computing modules in harsh plant environments
• Used with Compact single-board computers in embedded projects
• Can be used for data acquisition systems in mechanical testing rigs
• Ideal for edge computing modules in harsh plant environments
• Used with Compact single-board computers in embedded projects
• Can be used for data acquisition systems in mechanical testing rigs
What physical form factor is used for integration into Compact systems?
It uses the M.2 form factor in the 2242 size, enabling installation on boards that accept short M.2 modules.
How does the drive handle elevated internal device temperatures?
The drive is rated to operate at temperatures up to 85°C, allowing sustained operation in high-temperature enclosures.
What type of flash technology underpins storage durability and density?
The device employs 3D NAND architecture to increase bit density while maintaining endurance characteristics suited to industrial use.
Which Interface should the host support for communication with the drive?
The host must support NVMe over a PCIe Gen3 x2 link to achieve the intended connection and performance.
Is the product intended for internal or external installation?
The drive is designed for internal installation within the host system chassis.
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