TE Connectivity 1.02 mm Pitch 30 Way IC Socket

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Subtotaal (1 tray van 6 eenheden)*

€ 248,96

(excl. BTW)

€ 301,24

(incl. BTW)

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  • Verzending vanaf 12 maart 2026
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Tray(s)
Per tray
Per stuk*
1 +€ 248,96€ 41,493

*prijsindicatie

RS-stocknr.:
480-344
Artikelnummer Distrelec:
304-57-867
Fabrikantnummer:
1-1554653-1
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

IC Socket

Number of Contacts

30

Current

0.5A

Pitch

1.02mm

Contact Material

Copper Alloy

Contact Plating

Gold

Termination Type

Solder

Row Pitch

1.02mm

Device Mount Type

Board

Maximum Operating Temperature

260°C

Standards/Approvals

EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, UL 94V-0, 2016

Housing Material

High Temperature Thermoplastic

Land van herkomst:
CN
The TE Connectivity SOCKET ASSY LGA2011 is engineered to provide exceptional connectivity for high-performance applications. This advanced IC socket is specifically designed to accommodate devices with 2011 positions within a compact and robust structure. With its surface mount solder ball termination method, it ensures reliable operation in demanding environments. The socket's square frame design enhances stability while the high-temperature thermoplastic housing material guarantees durability. It is particularly ideal for configurations requiring a high pin count, making it an essential component in modern electronic systems. Additionally, compliance with industry standards such as UL 94V-0 reinforces its credibility and safety for diverse applications.

Optimised for high performance applications requiring 2011 positions

Durable construction using high temperature thermoplastic material

Square frame design elevates stability and ease of integration

Surface mount technology enables compact PCB layouts

Gold plated contact area ensures superior electrical conductivity

Low halogen materials contribute to environmentally friendly manufacturing

Reflow solder capability supports efficient assembly processes

Compliant with EU RoHS and REACH regulations

Versatile application in board to board configurations

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