Infineon 2 Independent IGBT, 900 A 1200 V AG-ECONOD-711
- RS-stocknr.:
- 258-0854
- Fabrikantnummer:
- FF900R12ME7B11NPSA1
- Fabrikant:
- Infineon
Subtotaal (1 tray van 10 eenheden)*
€ 1.644,36
(excl. BTW)
€ 1.989,68
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 04 juni 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per tray* |
|---|---|---|
| 10 + | € 164,436 | € 1.644,36 |
*prijsindicatie
- RS-stocknr.:
- 258-0854
- Fabrikantnummer:
- FF900R12ME7B11NPSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 900A | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Package Type | AG-ECONOD-711 | |
| Configuration | 2 Independent | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.8V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 900A | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Package Type AG-ECONOD-711 | ||
Configuration 2 Independent | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.8V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals No | ||
Automotive Standard No | ||
Niet conform
The Infineon EconoDUAL 3 1200 V, 900 A dual TRENCHSTOP IGBT7 module with emitter controlled 7 diode, NTC and PressFIT contact technology. Also available with pre-applied thermal interface material.
Highest power density
Isolated baseplate
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