Infineon 3 Phase IGBT, 25 A 1200 V AG-ECONO2C-311, Chassis
- RS-stocknr.:
- 258-0856
- Fabrikantnummer:
- FP15R12KE3GBPSA1
- Fabrikant:
- Infineon
Bulkkorting beschikbaar
Subtotaal (1 tray van 15 eenheden)*
€ 1.564,425
(excl. BTW)
€ 1.892,955
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 21 mei 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per tray* |
|---|---|---|
| 15 - 15 | € 104,295 | € 1.564,43 |
| 30 + | € 99,08 | € 1.486,20 |
*prijsindicatie
- RS-stocknr.:
- 258-0856
- Fabrikantnummer:
- FP15R12KE3GBPSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Maximum Continuous Collector Current Ic | 25A | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 105W | |
| Configuration | 3 Phase | |
| Package Type | AG-ECONO2C-311 | |
| Mount Type | Chassis | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 125°C | |
| Height | 17mm | |
| Standards/Approvals | RoHS | |
| Width | 45 mm | |
| Length | 107.5mm | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Maximum Continuous Collector Current Ic 25A | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 105W | ||
Configuration 3 Phase | ||
Package Type AG-ECONO2C-311 | ||
Mount Type Chassis | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 125°C | ||
Height 17mm | ||
Standards/Approvals RoHS | ||
Width 45 mm | ||
Length 107.5mm | ||
Automotive Standard No | ||
The Infineon EconoPIM 2 1200V three phase PIM IGBT module with IGBT3 and NTC is optimized customers development cycle time and cost, its fast, reliable and low cost mounting concept.
Low stray inductance module design
High reliability and power density
Copper base plate for optimized heat spread
Solder able pins
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