TE Connectivity, 1-2069 Memory Card Connector, Solder
- RS-stocknr.:
- 471-873
- Artikelnummer Distrelec:
- 304-62-864
- Fabrikantnummer:
- 1-2069838-3
- Fabrikant:
- TE Connectivity
Subtotaal (1 tray van 25 eenheden)*
€ 196,16
(excl. BTW)
€ 237,35
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 23 oktober 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s) | Per tray | Per stuk* |
|---|---|---|
| 1 + | € 196,16 | € 7,846 |
*prijsindicatie
- RS-stocknr.:
- 471-873
- Artikelnummer Distrelec:
- 304-62-864
- Fabrikantnummer:
- 1-2069838-3
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Product Type | Memory Card Connector | |
| Number of Rows | 1 | |
| Pitch | 2.5mm | |
| Orientation | Straight | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU RoHS 2011/65/EU, 2016, China RoHS 2 MIIT Order No 32, EU REACH (EC) No. 1907/2006, EU ELV 2000/53/EC | |
| Series | 1-2069 | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Product Type Memory Card Connector | ||
Number of Rows 1 | ||
Pitch 2.5mm | ||
Orientation Straight | ||
Termination Type Solder | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU RoHS 2011/65/EU, 2016, China RoHS 2 MIIT Order No 32, EU REACH (EC) No. 1907/2006, EU ELV 2000/53/EC | ||
Series 1-2069 | ||
- Land van herkomst:
- US
The TE Connectivity product represents cutting-edge engineering with its LGA115X design, ideal for applications requiring reliable thermal interfaces. Positioned as a fundamental component in high-performance computing systems, it enhances both thermal efficiency and reliability. Constructed with meticulous attention to detail, this solution ensures compatibility across various systems while simplifying the installation process. The innovative design caters to the evolving demands of technology, making it a robust choice for both advanced users and general consumers alike.
Optimized for effective thermal management within compact environments
Designed to integrate seamlessly with modern computing systems
Facilitates straightforward installation for users of all levels
Resilient build quality ensures longevity and reliability in performance
Enhances system efficiency through advanced engineering techniques
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