TE Connectivity 1 mm Pitch 240 Way, Vertical Board Mount DDR3 DIMM Socket ,1.5V, 750mA
- RS-stocknr.:
- 480-038
- Artikelnummer Distrelec:
- 304-62-857
- Fabrikantnummer:
- 1-1932000-0
- Fabrikant:
- TE Connectivity
Subtotaal (1 tray van 50 eenheden)*
€ 195,74
(excl. BTW)
€ 236,85
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Voorradig bij de fabrikant
- Klaar voor verzending vanaf 29 juni 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tray(s) | Per tray | Per stuk* |
|---|---|---|
| 1 + | € 195,74 | € 3,915 |
*prijsindicatie
- RS-stocknr.:
- 480-038
- Artikelnummer Distrelec:
- 304-62-857
- Fabrikantnummer:
- 1-1932000-0
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Insertion/Removal Method | Direct Insert | |
| Orientation | Vertical | |
| Current | 750mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 240 | |
| Pitch | 1mm | |
| Mount Type | Board | |
| Housing Material | Nylon | |
| SDRAM Type | DDR3 | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Row Spacing | 1.9mm | |
| Maximum Operating Temperature | 155°C | |
| Standards/Approvals | EU RoHS Directive 2011/65/EU Compliant, 2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, UL 94V-0 | |
| Voltage | 1.5V | |
| Series | DDR3 DIMM | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Insertion/Removal Method Direct Insert | ||
Orientation Vertical | ||
Current 750mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 240 | ||
Pitch 1mm | ||
Mount Type Board | ||
Housing Material Nylon | ||
SDRAM Type DDR3 | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Row Spacing 1.9mm | ||
Maximum Operating Temperature 155°C | ||
Standards/Approvals EU RoHS Directive 2011/65/EU Compliant, 2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, UL 94V-0 | ||
Voltage 1.5V | ||
Series DDR3 DIMM | ||
- Land van herkomst:
- CN
The TE Connectivity Double Data Rate (DDR) 3 Board-to-Board socket is engineered for superior performance in memory applications. Designed with 240 positions, it adeptly facilitates seamless connectivity under various operational conditions. Its vertical module orientation optimises space on the PCB, while the through-hole solder termination assures reliable and robust mounting. Crafted with high-temperature nylon, this socket boasts impressive durability and resilience. The innovative design supports a wide operating temperature range, making it suitable for diverse applications. Whether you are working on consumer electronics or complex computing systems, this socket guarantees consistent signal integrity and high-performance standards.
Offers a robust connection for DDR applications
Facilitates efficient board to board communication
Designed to withstand extreme temperature variations
Constructed from high quality materials for enhanced longevity
Supports easy insertion with direct insert methodology
Optimises space utilisation on printed circuit boards
Features a natural latch colour for aesthetic integration
Includes a range of compatible parts for versatile application
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