TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2 V, 500mA

Subtotaal (1 rol van 250 eenheden)*

€ 454,25

(excl. BTW)

€ 549,64

(incl. BTW)

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  • Verzending vanaf 13 april 2026
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RS-stocknr.:
481-905
Artikelnummer Distrelec:
304-59-558
Fabrikantnummer:
2309414-3
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Contact Material

Copper Alloy

Current

500mA

Contact Plating

Gold

Number of Contacts

260

Pitch

0.5mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Latching

Yes

Row Spacing

8.2mm

Maximum Operating Temperature

85°C

Standards/Approvals

UL 94 V-0

Series

DDR4 DIMM

Voltage

1.2 V

Land van herkomst:
CN
The TE Connectivity Small outline DDR4 SO DIMM socket is engineered for superior performance and reliability in compact electronic applications. With a stack height of just 9.2 mm and a right angle module orientation, it facilitates efficient space utilisation while ensuring robust connections. This socket accommodates up to 260 positions and features a .5 mm centreline pitch, designed specifically for high-speed memory applications. Its high-temperature thermoplastic housing guarantees durability, while innovative design elements, such as reverse keying and locking ejectors, enhance user experience during installation and maintenance. The product complies with stringent industry standards and regulations, making it an ideal choice for modern computing environments.

Designed for seamless integration into high speed memory solutions

Constructed from materials that ensure longevity and reliable performance

Includes advanced mounting features for secure PCB attachment

Optimised for a wide operating temperature range for versatile applications

Features low halogen materials promoting environmentally friendly use

Facilitates straightforward installation with intuitive alignment mechanisms

Accommodates a variety of memory configurations to meet diverse needs

Backed by comprehensive compliance documentation to support regulatory requirements

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