TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2V, 500mA
- RS-stocknr.:
- 481-905
- Artikelnummer Distrelec:
- 304-59-558
- Fabrikantnummer:
- 2309414-3
- Fabrikant:
- TE Connectivity
Momenteel niet beschikbaar
We weten niet of dit artikel weer voorradig zal zijn, het wordt door de fabrikant stopgezet.
- RS-stocknr.:
- 481-905
- Artikelnummer Distrelec:
- 304-59-558
- Fabrikantnummer:
- 2309414-3
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DIMM | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Cam-In | |
| Contact Material | Copper Alloy | |
| Current | 500mA | |
| Contact Plating | Gold | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mount Type | Board | |
| Housing Material | High Temperature Thermoplastic | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Latching | Yes | |
| Row Spacing | 8.2mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL 94 V-0 | |
| Series | DDR4 DIMM | |
| Voltage | 1.2V | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Product Type DIMM Socket | ||
Memory Socket Type DIMM | ||
Orientation Right Angle | ||
Insertion/Removal Method Cam-In | ||
Contact Material Copper Alloy | ||
Current 500mA | ||
Contact Plating Gold | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mount Type Board | ||
Housing Material High Temperature Thermoplastic | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Latching Yes | ||
Row Spacing 8.2mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL 94 V-0 | ||
Series DDR4 DIMM | ||
Voltage 1.2V | ||
- Land van herkomst:
- CN
The TE Connectivity Small outline DDR4 SO DIMM socket is engineered for superior performance and reliability in compact electronic applications. With a stack height of just 9.2 mm and a right angle module orientation, it facilitates efficient space utilisation while ensuring robust connections. This socket accommodates up to 260 positions and features a .5 mm centreline pitch, designed specifically for high-speed memory applications. Its high-temperature thermoplastic housing guarantees durability, while innovative design elements, such as reverse keying and locking ejectors, enhance user experience during installation and maintenance. The product complies with stringent industry standards and regulations, making it an ideal choice for modern computing environments.
Designed for seamless integration into high speed memory solutions
Constructed from materials that ensure longevity and reliable performance
Includes advanced mounting features for secure PCB attachment
Optimised for a wide operating temperature range for versatile applications
Features low halogen materials promoting environmentally friendly use
Facilitates straightforward installation with intuitive alignment mechanisms
Accommodates a variety of memory configurations to meet diverse needs
Backed by comprehensive compliance documentation to support regulatory requirements
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