Microchip SAMA7G54-V/4HB ARM Cortex Microcontroller, 1 GHz, 343-Pin TFBGA
- RS-stocknr.:
- 249-2491
- Fabrikantnummer:
- SAMA7G54-V/4HB
- Fabrikant:
- Microchip
Bulkkorting beschikbaar
Subtotaal (1 eenheid)*
€ 9,22
(excl. BTW)
€ 11,16
(incl. BTW)
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|---|---|
| 1 - 9 | € 9,22 |
| 10 - 24 | € 9,04 |
| 25 - 49 | € 8,65 |
| 50 - 74 | € 8,44 |
| 75 + | € 8,22 |
*prijsindicatie
- RS-stocknr.:
- 249-2491
- Fabrikantnummer:
- SAMA7G54-V/4HB
- Fabrikant:
- Microchip
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Microchip | |
| Product Type | Microcontroller | |
| Package Type | TFBGA | |
| Mount Type | Surface | |
| Pin Count | 343 | |
| Device Core | ARM Cortex | |
| Interface Type | SDIO, QSPI | |
| Maximum Clock Frequency | 1GHz | |
| RAM Size | 128kB | |
| Maximum Supply Voltage | 1.21V | |
| Minimum Operating Temperature | -40°C | |
| Number of Programmable I/Os | 136 | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS Compliant | |
| Minimum Supply Voltage | 1.12V | |
| Automotive Standard | No | |
| ADCs | 12 bit | |
| Alles selecteren | ||
|---|---|---|
Merk Microchip | ||
Product Type Microcontroller | ||
Package Type TFBGA | ||
Mount Type Surface | ||
Pin Count 343 | ||
Device Core ARM Cortex | ||
Interface Type SDIO, QSPI | ||
Maximum Clock Frequency 1GHz | ||
RAM Size 128kB | ||
Maximum Supply Voltage 1.21V | ||
Minimum Operating Temperature -40°C | ||
Number of Programmable I/Os 136 | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS Compliant | ||
Minimum Supply Voltage 1.12V | ||
Automotive Standard No | ||
ADCs 12 bit | ||
This Microchip high-performance, Arm Cortex-A7 CPU-based embedded microprocessor (MPU) running up to 1 GHz. It supports multiple memories such as 16-bit DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 with flexible boot options from octal/quad SPI, SD/eMMC as well as 8-bit SLC/MLC NAND Flash.
Optimized BGA ball-out facilitates 4-layer PCB designs
Optimized Power Management IC and Integrated LDOs
Well-suited for IoT security requirements
Large number of connectivity options
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