Murata 100 pF, 25V dc, ±10 %, Surface
- RS-stocknr.:
- 170-5749
- Fabrikantnummer:
- GRM033B11E101KA01D
- Fabrikant:
- Murata
Momenteel niet beschikbaar
We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 170-5749
- Fabrikantnummer:
- GRM033B11E101KA01D
- Fabrikant:
- Murata
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Murata | |
| Capacitance | 100 pF | |
| Voltage | 25 V dc | |
| Tolerance | ±10 % | |
| Mount Type | Surface | |
| Height | 300 μm | |
| Length | 600 μm | |
| Maximum Operating Temperature | 85 °C | |
| Minimum Operating Temperature | -25 °C | |
| Package/Case | 0201 | |
| Series | GRM | |
| Alles selecteren | ||
|---|---|---|
Merk Murata | ||
Capacitance 100 pF | ||
Voltage 25 V dc | ||
Tolerance ±10 % | ||
Mount Type Surface | ||
Height 300 μm | ||
Length 600 μm | ||
Maximum Operating Temperature 85 °C | ||
Minimum Operating Temperature -25 °C | ||
Package/Case 0201 | ||
Series GRM | ||
Murata GRM 0201 B Dielectric
GRM High Dielectric Constant Type is Ideal for Decoupling and Smoothing Circuits, and for Rated voltages of 200V min they are best for Clamp Snubber circuits and Smoothing Circuits
Large Capacity in small size multilayer structure
High Reliability with no polarity
External Electrodes are Tin Plated thus excellent solderability
Chip Dimensions 0201 in (0.6 x 0.3 mm)
0201 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn)
Applications include mobile phones, video and tuner designs
C0G/NP0 is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials
X7R, X5R formulations are called "temperature stable" Ceramics and fall into the EIA Class II materials
Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are Ideal for decoupling applications.
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