TDK 1 μF Multilayer Ceramic Capacitor, 16V dc, ±10 %, Surface
- RS-stocknr.:
- 179-5508
- Fabrikantnummer:
- CGA4J3X8R1C105K125AD
- Fabrikant:
- TDK
Bulkkorting beschikbaar
Bekijk bulkkortingSubtotaal (1 verpakking van 50 eenheden)*
€ 6,80
(excl. BTW)
€ 8,25
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Op voorraad
- Plus verzending 1.400 stuk(s) vanaf 12 oktober 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per verpakking* |
|---|---|---|
| 50 - 200 | € 0,136 | € 6,80 |
| 250 - 450 | € 0,089 | € 4,45 |
| 500 - 950 | € 0,082 | € 4,10 |
| 1000 + | € 0,075 | € 3,75 |
*prijsindicatie
- RS-stocknr.:
- 179-5508
- Fabrikantnummer:
- CGA4J3X8R1C105K125AD
- Fabrikant:
- TDK
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 1μF | |
| Voltage | 16V dc | |
| Package/Case | 0805 | |
| Packaging | Tape & Reel | |
| Mount Type | Surface | |
| Dielectric | X8R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Series | CGA | |
| Height | 1.25mm | |
| Standards/Approvals | No | |
| Width | 1.25mm | |
| Length | 2mm | |
| Suppression Class | Class II | |
| Maximum Operating Temperature | 150°C | |
| Alles selecteren | ||
|---|---|---|
Merk TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 1μF | ||
Voltage 16V dc | ||
Package/Case 0805 | ||
Packaging Tape & Reel | ||
Mount Type Surface | ||
Dielectric X8R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Series CGA | ||
Height 1.25mm | ||
Standards/Approvals No | ||
Width 1.25mm | ||
Length 2mm | ||
Suppression Class Class II | ||
Maximum Operating Temperature 150°C | ||
- Land van herkomst:
- JP
Features
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical and thermal strength when use with conductive glue.
Design
Applications
Transmission control
Engine sensor module
Automotive power train ABS
Application requiring conductive glue mounting Method
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