TDK 4.7 μF Multilayer Ceramic Capacitor, 35V dc, ±20 %, Surface
- RS-stocknr.:
- 242-7489
- Fabrikantnummer:
- CGA4J1X7R1V475M125AE
- Fabrikant:
- TDK
Subtotaal (1 rol van 2000 eenheden)*
€ 328,00
(excl. BTW)
€ 396,00
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 20 november 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk | Per rol* |
|---|---|---|
| 2000 + | € 0,164 | € 328,00 |
*prijsindicatie
- RS-stocknr.:
- 242-7489
- Fabrikantnummer:
- CGA4J1X7R1V475M125AE
- Fabrikant:
- TDK
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 4.7μF | |
| Voltage | 35V dc | |
| Package/Case | 0805 | |
| Construction | Stacked | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X7R | |
| Tolerance | ±20 % | |
| Automotive Standard | AEC-Q200 | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Series | CGA | |
| Length | 2mm | |
| Height | 1.25mm | |
| Width | 1.25mm | |
| Standards/Approvals | REACH, RoHS | |
| Maximum Operating Temperature | 125°C | |
| Alles selecteren | ||
|---|---|---|
Merk TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 4.7μF | ||
Voltage 35V dc | ||
Package/Case 0805 | ||
Construction Stacked | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X7R | ||
Tolerance ±20 % | ||
Automotive Standard AEC-Q200 | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Series CGA | ||
Length 2mm | ||
Height 1.25mm | ||
Width 1.25mm | ||
Standards/Approvals REACH, RoHS | ||
Maximum Operating Temperature 125°C | ||
The TDK soft termination CGA series, automotive grade of TDK's multilayer ceramic chip capacitor, is a product incorporating a conductive resin layer into the terminal electrodes. The resin layer protects the ceramic body from cracks by relieving stress caused by thermal shock and board flexure. It is used in applications such as fail safe design for battery line, prevention of ceramic element crack by board bending, prevention of solder crack by thermal shock, equipment such as mobile devices and smart key having a high possibility of drop.
High resistance to mechanical stress and thermal shock by resin layers
X8R and X8L type whose maximum temperature are up to 150 degree Celsius are available
C0G type having excellent stable temperature and DC-bias characteristics is also available
AEC-Q20
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