Vishay IRFL210 Type N-Channel Power MOSFET, 960 mA, 200 V Enhancement, 4-Pin SOT-223 IRFL210TRPBF

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Verpakkingsopties
RS-stocknr.:
815-2736
Fabrikantnummer:
IRFL210TRPBF
Fabrikant:
Vishay
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Merk

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

960mA

Maximum Drain Source Voltage Vds

200V

Series

IRFL210

Package Type

SOT-223

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

1.5Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

8.2nC

Maximum Gate Source Voltage Vgs

20V

Maximum Power Dissipation Pd

3.1W

Minimum Operating Temperature

-55°C

Forward Voltage Vf

2V

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Height

1.8mm

Length

6.7mm

Width

3.7mm

Automotive Standard

No

Vishay IRFL210 Series Power MOSFET, 200V Maximum Drain Source Voltage, 960mA Maximum Continuous Drain Current - IRFL210TRPBF


This power MOSFET is a surface-mount N-channel enhancement device designed for switching and amplification in electronic control and power-conversion circuits. It offers high-voltage capability and a gate-drive range suitable for low-voltage control, making it appropriate for applications requiring Compact SOT-223 packaging and moderate continuous drain performance.

Features and Benefits:


• 200V Vds enabling high-voltage switching capability
• 1.5Ω Rds providing predictable on-resistance for load control
• 960mA continuous drain current supporting moderate loads
• 8.2nC typical gate charge enabling low-drive energy requirements
• 20V maximum gate-source voltage allowing standard gate-drive margins
• 3.1W power dissipation for thermal planning in constrained assemblies

Applications


• Suitable for mid-voltage power supplies and converters
• Ideal for motor drive control in small automation systems
• Used for switch-mode regulation in instrumentation
• Can be used for load switching in control panels

What operating temperature range can I expect for reliability?


The device operates from -55°C up to a maximum junction temperature of 150°C, which informs thermal design and derating for sustained use.

How should I account for package-related thermal limits?


Maximum power dissipation is 3.1W

thermal management must consider PCB copper area and ambient conditions to avoid exceeding this limit.

What gate-drive constraints must be observed?


Gate voltage must not exceed 20V to prevent gate-oxide stress, and the typical gate charge of 8.2nC determines the required drive current for switching speeds.

What mechanical footprint considerations are there for assembly?


The component is supplied in an SOT-223 package with a pin count of 4, which affects solder-pad layout and reflow profiles.

Are there restrictions on continuous current capability?


Continuous drain current is specified at 960mA, so designs should include margin for inrush and transient conditions.

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