TE Connectivity MULTIGIG RT Series Vertical Board PCB Header, 144 Contact(s), 1.8 mm Pitch, 9 Row, Unshrouded

Bekijk alle PCB Headers

Subtotaal (1 tube van 17 eenheden)*

€ 473,70

(excl. BTW)

€ 573,18

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Bestellingen onder € 75,00 (excl. BTW) € 5,95.
Tijdelijk niet op voorraad
  • Verzending vanaf 10 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tube(s)
Per tube
Per stuk*
1 +€ 473,70€ 27,865

*prijsindicatie

RS-stocknr.:
467-199
Artikelnummer Distrelec:
304-64-451
Fabrikantnummer:
1410965-1
Fabrikant:
TE Connectivity
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

TE Connectivity

Product Type

PCB Header

Series

MULTIGIG RT

Pitch

1.8mm

Current

1A

Number of Contacts

144

Number of Rows

9

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Row Pitch

1.8mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Standards/Approvals

EU ELV Directive 2000/53/EC

Land van herkomst:
US
The TE Connectivity high-speed backplane connector is designed to meet the demanding needs of modern electronic applications. Featuring an intricate 144-position layout, this connector ensures secure and efficient connections for power and signal transmission. Its vertical, unshrouded design maximises space utilisation on your PCB, promoting streamlined assembly and performance. Constructed to comply with robust industry standards, the connector is suitable for traditional backplane architecture. With a centreline of 1.8 mm, the product supports easy alignment and mating, while its durable materials offer a temperature operating range from -55 to 105 °C, making it ideal for various environments. Experience unmatched reliability in connectivity with this meticulously engineered solution.

Offers 144 positions to provide extensive connectivity

Constructed for vertical PCB mounting to optimise layout

Mating alignment features ensure perfect fit during assembly

Accommodates traditional backplane architecture for seamless integration

Designed for power and signal applications for versatile usage

Low halogen content meets environmental safety requirements

Compatible with backplane PCB types enhancing flexibility in design

Exhibits robust mechanical attachment for enhanced stability

Gerelateerde Links