TE Connectivity AMPMODU PCB Headers & Receptacles Series Vertical Board PCB Header, 20 Contact(s), 1.27 mm Pitch, 2 Row,

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Subtotaal (1 rol van 300 eenheden)*

€ 2.021,81

(excl. BTW)

€ 2.446,39

(incl. BTW)

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  • Verzending vanaf 02 februari 2026
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RS-stocknr.:
467-230
Fabrikantnummer:
147378-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMPMODU PCB Headers & Receptacles

Product Type

PCB Header

Current

3.6A

Pitch

1.27mm

Number of Contacts

20

Housing Material

Polyphthalamide

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Row Pitch

1.27mm

Termination Type

Surface Mount

Minimum Operating Temperature

65°C

Contact Gender

Female

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-53-678

Niet conform

Land van herkomst:
MX
The TE Connectivity PCB Mount Receptacle is an integral component for board-to-board connections, designed to facilitate efficient signal transmissions. Its unique configuration features 20 positions and a vertical PCB mount orientation, ensuring solid alignment and compact integration into your electronic assemblies. With robust electrical characteristics, including an operating voltage of 30 VAC and excellent insulation resistance, this connector provides reliable performance under diverse operational conditions. Additionally, the device boasts a durable housing material designed to withstand various environmental challenges. This product exemplifies the commitment to quality and functionality expected from industry-leading manufacturers.

Designed for seamless integration into electronic assemblies

Offers a reliable connection for board-to-board applications

Features excellent insulation properties for enhanced safety

Provides a compact design with efficient use of space

Facilitates easy assembly with its surface mount termination method

Constructed with resilient materials to withstand temperature variations

Compatible with industry standards, ensuring broader application suitability

Optimised for reflow solder processes, enhancing assembly efficiency

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