TE Connectivity Dynamic 3000 Series Vertical Board PCB Header, 5 Contact(s), 3.81 mm Pitch, 1 Row, Shrouded

Bekijk alle PCB Headers

Subtotaal (1 tube van 51 eenheden)*

€ 279,57

(excl. BTW)

€ 338,28

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending vanaf 24 februari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tube(s)
Per tube
Per stuk*
1 +€ 279,57€ 5,482

*prijsindicatie

RS-stocknr.:
471-445
Artikelnummer Distrelec:
304-64-295
Fabrikantnummer:
1-1903481-2
Fabrikant:
TE Connectivity
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

TE Connectivity

Series

Dynamic 3000

Product Type

PCB Header

Pitch

3.81mm

Current

15A

Number of Contacts

5

Housing Material

Glass Filled Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Gold

Termination Type

Solder

Row Pitch

3.81mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Land van herkomst:
CN
The TE Connectivity PCB Mount Header provides a reliable wire-to-board connection in a compact design, perfectly suited for modern electronic applications. Engineered for efficiency, this connector features five positions arranged in a vertical orientation, accommodating a 3.81 mm centerline. With its fully shrouded design and gold plating, it offers excellent conductivity and protection against environmental factors. The robust construction ensures durability and long-lasting performance, making it ideal for various applications within the Dynamic 3000 Series. By integrating seamless soldering capabilities and superior mating retention, this component simplifies the assembly process and ensures a secure electrical connection, enhancing overall device efficiency.

Designed for easy integration into PCB layouts

Vertical orientation aids in space-saving configurations

Fully shrouded design mitigates the risk of misalignment

Gold plating enhances conductivity and reduces oxidation

Solder peg retention provides additional stability during assembly

Appropriate for both power and signal applications

Serves well in a temperature range suitable for demanding environments

Box and tube packaging options ensure safe delivery

Gerelateerde Links