TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

Bekijk alle PCB Headers

Subtotaal (1 tube van 112 eenheden)*

€ 210,91

(excl. BTW)

€ 255,20

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Bestellingen onder € 75,00 (excl. BTW) € 5,95.
Tijdelijk niet op voorraad
  • Verzending vanaf 16 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Tube(s)
Per tube
Per stuk*
1 +€ 210,91€ 1,883

*prijsindicatie

RS-stocknr.:
471-891
Artikelnummer Distrelec:
304-48-108
Fabrikantnummer:
1-103735-1
Fabrikant:
TE Connectivity
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

12

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

3.3mm

Contact Gender

Male

Maximum Operating Temperature

105°C

Mating Pin Length

5.84mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

60 V

Niet conform

Land van herkomst:
MX
The TE Connectivity PCB Mount Header is a versatile interconnect solution designed for seamless wire-to-board connections in various electronic applications. Featuring a fully shrouded design, this connector boasts a compact 12-position configuration with a 2.54 mm centreline, making it ideal for space-constrained environments. Engineered for reliability, the header ensures a secure electrical connection through its through-hole solder termination method. The robust construction facilitates ease of installation, while the high-quality materials selected enhance the performance across a wide operating temperature range. This product is an essential choice for engineers seeking dependable connectivity solutions in demanding conditions.

Compact design optimised for space efficiency

Fully shrouded to provide protection against environmental factors

Reliable wire to board connection for improved signal integrity

Solder termination method enables strong lasting connections

Thermoplastic housing ensures longevity and durability

Mating retention mechanism enhances connection stability

Gerelateerde Links