TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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Subtotaal (1 tube van 112 eenheden)*

€ 210,91

(excl. BTW)

€ 255,20

(incl. BTW)

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  • Verzending vanaf 02 februari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 210,91€ 1,883

*prijsindicatie

RS-stocknr.:
471-891
Fabrikantnummer:
1-103735-1
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

12

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Brass

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Tail Pin Length

3.3mm

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Mating Pin Length

5.84mm

Voltage

60 V

Distrelec Product Id

304-48-108

Niet conform

Land van herkomst:
MX
The TE Connectivity PCB Mount Header is a versatile interconnect solution designed for seamless wire-to-board connections in various electronic applications. Featuring a fully shrouded design, this connector boasts a compact 12-position configuration with a 2.54 mm centreline, making it ideal for space-constrained environments. Engineered for reliability, the header ensures a secure electrical connection through its through-hole solder termination method. The robust construction facilitates ease of installation, while the high-quality materials selected enhance the performance across a wide operating temperature range. This product is an essential choice for engineers seeking dependable connectivity solutions in demanding conditions.

Compact design optimised for space efficiency

Fully shrouded to provide protection against environmental factors

Reliable wire to board connection for improved signal integrity

Solder termination method enables strong lasting connections

Thermoplastic housing ensures longevity and durability

Mating retention mechanism enhances connection stability

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