TE Connectivity AMPMODU Series Vertical PCB PCB Header, 14 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

Subtotaal (1 tube van 123 eenheden)*

€ 285,94

(excl. BTW)

€ 345,99

(incl. BTW)

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  • Verzending vanaf 02 februari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 285,94€ 2,325

*prijsindicatie

RS-stocknr.:
476-755
Fabrikantnummer:
2842131-7
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2mm

Current

2A

Housing Material

Polyamide Fibreglass

Number of Contacts

14

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

PCB

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

2mm

Maximum Operating Temperature

125°C

Tail Pin Length

2.8mm

Standards/Approvals

UL 94V-0, UL E28476, UL Recognised

Mating Pin Length

4mm

Voltage

125 V

Distrelec Product Id

304-53-956

Land van herkomst:
CN
The TE Connectivity PCB Mount Header is designed to streamline board-to-board connections with precision and reliability. Featuring a vertical orientation, this connector offers an impressive 14-position configuration with a compact 2 mm centerline pitch. Ideal for applications where space is at a premium, it boasts a breakaway header type for easy assembly and disassembly. Crafted from durable materials, the header is equipped with gold-plated contacts, ensuring superior conductivity and resistance to corrosion. This versatile connector is suitable for various electronic applications, including signal transmission, making it an essential component for modern circuit designs. With capabilities for through-hole soldering, it promises a strong mechanical bond and electrical performance across diverse environments.

Designed for efficient board-to-board communication

Breakaway configuration simplifies assembly processes

Durable thermoplastic housing withstands demanding conditions

High dielectric withstand voltage enhances safety and functionality

Compact footprint maximizes space efficiency in circuit designs

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