TE Connectivity Dynamic 3000 Series Horizontal Board PCB Header, 16 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded
- RS-stocknr.:
- 479-268
- Artikelnummer Distrelec:
- 304-50-374
- Fabrikantnummer:
- 178307-3
- Fabrikant:
- TE Connectivity
Subtotaal (1 verpakking van 36 eenheden)*
€ 395,33
(excl. BTW)
€ 478,35
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 23 februari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 395,33 | € 10,981 |
*prijsindicatie
- RS-stocknr.:
- 479-268
- Artikelnummer Distrelec:
- 304-50-374
- Fabrikantnummer:
- 178307-3
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Series | Dynamic 3000 | |
| Product Type | PCB Header | |
| Pitch | 3.81mm | |
| Current | 8A | |
| Housing Material | Fibreglass Polyester | |
| Number of Contacts | 16 | |
| Number of Rows | 2 | |
| Orientation | Horizontal | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Board | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Row Pitch | 3.81mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 105°C | |
| Tail Pin Length | 3.8mm | |
| Standards/Approvals | 2016 Compliant, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant, TUV Certificate, UL 94V-0 | |
| Voltage | 250 V | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Series Dynamic 3000 | ||
Product Type PCB Header | ||
Pitch 3.81mm | ||
Current 8A | ||
Housing Material Fibreglass Polyester | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Orientation Horizontal | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Board | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Row Pitch 3.81mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 105°C | ||
Tail Pin Length 3.8mm | ||
Standards/Approvals 2016 Compliant, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant, TUV Certificate, UL 94V-0 | ||
Voltage 250 V | ||
- Land van herkomst:
- JP
The TE Connectivity PCB Mount Header, designed for horizontal placement in wire-to-board applications, seamlessly integrates into your electronic projects, offering an ideal solution for precise connectivity. With its robust build and fully shrouded design, this connector ensures reliable performance and safety in various operating conditions. The product boasts a sophisticated gold contact plating that not only enhances connectivity but also extends operational longevity. As part of the Dynamic 3000 Series, it embodies a commitment to high-performance engineering, targeting both power and signal circuits. The advanced design, including a two-row configuration with 16 positions, simplifies the assembly process while ensuring secure and firm connections. Whether you're developing complex circuitry or simple electronic frameworks, this header provides versatility and reliability, enabling enhanced productivity with every application.
Robust construction ensures reliable long-term performance
Fully shrouded design increases safety and reduces short-circuit risks
Gold contact plating provides superior electrical connectivity
Versatile for both power and signal applications
Designed for easy integration into diverse electronic projects
Multi-row design optimises space usage on printed circuit boards
Temperature resilient from -55°C to 105°C, enhancing reliability in extreme conditions
Wave solder capable for efficient assembly processes
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