TE Connectivity AMPMODU Series Vertical Board PCB Header, 80 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded

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Subtotaal (1 tube van 9 eenheden)*

€ 220,47

(excl. BTW)

€ 266,77

(incl. BTW)

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  • Verzending vanaf 23 februari 2026
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Tube(s)
Per tube
Per stuk*
1 +€ 220,47€ 24,497

*prijsindicatie

RS-stocknr.:
480-365
Artikelnummer Distrelec:
304-53-642
Fabrikantnummer:
104550-8
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3.6A

Pitch

1.27mm

Housing Material

Thermoplastic

Number of Contacts

80

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Row Pitch

1.27mm

Contact Gender

Female

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Niet conform

Land van herkomst:
MX
The TE Connectivity PCB Mount Receptacle is a sophisticated connector designed for vertical board-to-board applications, integrating advanced engineering within its 80-position layout. Precision-engineered for seamless performance, this receptacle features a 1.27 mm centreline, ensuring reliable connectivity across circuits. With a robust construction that includes gold plating and surface mount capabilities, it combines durability with optimal signal transmission. Its sleek black housing not only enhances aesthetic appeal but also ensures compatibility across various applications within the AMPMODU System 50 series. Whether used in industrial settings or consumer electronics, this receptacle delivers on both functionality and reliability, making it an essential component for any PCB design.

Designed for board to board configurations to facilitate effective connections

Robust retention features ensure secure mounting on the PCB

Operating temperature range accommodates diverse environmental conditions

Low halogen materials promote environmentally friendly usage

Optimised for reflow solder processes simplifying assembly requirements

PCB mount orientation maximises layout flexibility for various applications

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