Phoenix Contact MCD Series Wave Soldering Mount PCB Header, 3 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

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€ 1.810,28

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€ 2.190,44

(incl. BTW)

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  • Verzending vanaf 20 februari 2026
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RS-stocknr.:
487-828
Fabrikantnummer:
1227629
Fabrikant:
Phoenix Contact
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Merk

Phoenix Contact

Series

MCD

Product Type

PCB Header

Pitch

3.81mm

Current

8A

Housing Material

Polyamide

Number of Contacts

3

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON MC 1.5

Mount Type

Wave Soldering Mount

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Row Pitch

3.81mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Male

Tail Pin Length

3.5mm

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

3.5mm

Voltage

160 V

Land van herkomst:
DE
The Phoenix Contact PCB header is a versatile solution designed to enhance connectivity in various electronic applications. Engineered with precision, this innovative component facilitates maximum flexibility for device design, allowing integration with different connection technologies all within a single header. Notably, its reliable construction supports nominal currents of 8 A and rated voltages up to 160 V, making it Ideal for demanding industrial environments. The robust design incorporates a dual-row configuration with linear pinning, ensuring secure and stable electrical connections while optimising space within electronic assemblies. The product's compliance with stringent standards further ensures its performance and longevity in critical applications.

Offers a streamlined design that simplifies PCB layout

Meets stringent industry standards for enhanced safety and performance

Facilitates wave soldering for efficient assembly processes

Promotes a high contact density, Ideal for Compact applications

Conforms to environmental regulations ensuring sustainable use

Produced with RoHS-compliant materials for eco-friendly operations

Provides reliable electrical connections over extended periods

Enables easy integration into a variety of electronic devices

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