Phoenix Contact MCDNV Series Vertical Wave Soldering Mount PCB Header, 20 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

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We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
RS-stocknr.:
492-770
Fabrikantnummer:
1750313
Fabrikant:
Phoenix Contact
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Merk

Phoenix Contact

Product Type

PCB Header

Series

MCDNV

Pitch

3.81mm

Current

8A

Number of Contacts

20

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

5 MCDN 1, COMBICON FMC 1

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Row Pitch

3.81mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

100°C

Tail Pin Length

2.6mm

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

2.6mm

Voltage

160V

Land van herkomst:
DE
The Phoenix Contact PC Board header is designed to offer exceptional versatility in electronic device connections, integrating seamlessly into the modern SMT soldering process. With its compact design, it allows for a tailored fit on PCBs, enhancing the overall device layout. The product features an efficient pin layout and boasts a robust construction that's compatible with multiple connection technologies, allowing for a streamlined assembly process. Its remarkable specifications ensure high reliability and performance under various operational conditions, supporting a nominal current of 8 A and rated voltage up to 160 V. Whether you are developing new devices or upgrading existing designs, this PCB header balances efficient space utilisation with high-performance standards, delighting engineers and product developers alike.

Facilitates vertical connection arrangements for multi-row setups

Solder pins designed for simple integration and reliability

Provides maximum flexibility for diverse connector technologies

Composed of materials meeting WEEE/RoHS compliance standards

Supports installation using reflow and wave soldering processes

Developed for high-density PCB applications without compromising performance

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