TE Connectivity MIS Series Vertical Board PCB Header, 3 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded

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€ 234,10

(excl. BTW)

€ 283,26

(incl. BTW)

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  • Verzending vanaf 02 februari 2026
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RS-stocknr.:
501-228
Fabrikantnummer:
177537-3
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

MIS

Pitch

2.5mm

Current

4A

Housing Material

66 Nylon

Number of Contacts

3

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Tin Plated

Minimum Operating Temperature

-25°C

Row Pitch

2.5mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.17mm

Standards/Approvals

UL 94V-0

Mating Pin Length

3.4mm

Voltage

250 V

Land van herkomst:
CN
The TE Connectivity PCB Mount Header is a sophisticated connection solution designed for wire-to-board applications. Its vertical configuration is specifically engineered for easy integration into PCB layouts, allowing for a clean and efficient assembly. This product features a partially shrouded header type, enhancing safety and providing excellent reliability in signal transmission. Crafted from durable materials, it ensures resilience under various operating conditions. With a compact footprint and a 2.5 mm centreline, this connector accommodates a streamlined design while maintaining top-notch performance across its specifications. This product specifically caters to engineers looking for reliable connections in intricate electronic environments, making it an ideal choice for diverse applications.

Offers a reliable connection for wire-to-board configurations

Designed for simple, effective integration into printed circuit boards

Partially shrouded design enhances safety during operations

Accommodates multiple positions, supporting versatile applications

Constructed with robust materials for dependable long-term use

Optimised for efficient space utilisation on PCBs

Facilitates durable connections even in demanding conditions

Ensures compatibility with standard assembly processes

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