TE Connectivity MTA-156 Series Right Angle Board PCB Header, 12 Contact(s), 3.96 mm Pitch, 1 Row, Shrouded

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€ 221,76

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€ 268,33

(incl. BTW)

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  • Verzending vanaf 26 januari 2026
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RS-stocknr.:
501-419
Fabrikantnummer:
1-640387-2
Fabrikant:
TE Connectivity
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Merk

TE Connectivity

Product Type

PCB Header

Series

MTA-156

Pitch

3.96mm

Current

14.24A

Number of Contacts

12

Housing Material

Fibreglass Thermoplastic Polyester

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

3.96mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Mating Pin Length

10.16mm

Standards/Approvals

CSA, UL

Voltage

60 V

Land van herkomst:
CN
The TE Connectivity PCB Mount Header is an exceptional connectivity solution designed for right angle wire-to-board applications, offering a robust assembly for enhanced reliability. It features a 12-position configuration, making it ideal for a variety of circuit applications. With its partially shrouded design and tin plating, this connector ensures superior performance while maintaining a compact footprint. Engineered from durable thermoplastic polyester, it withstands harsh operating environments and provides optimal thermal stability, ensuring your connections remain secure and dependable. The versatility of this connector is further highlighted by its compatibility with various industry standards, making it a preferred choice for engineers seeking quality and efficiency.

Supports a board mount configuration for ease of installation

Designed for a reliable wire-to-board connection enhancing circuit integrity

Operating temperature range ensures functionality in diverse environments

Manufactured with nickel and tin plating for excellent conductivity

Offers friction lock mating retention to secure connections under vibration

The connector supports effective heat dissipation with its compact height

Wave solder capable, ensuring high assembly reliability during production

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