TE Connectivity AMPMODU Series Vertical Board PCB Header, 80 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Bekijk alle PCB Headers

Subtotaal (1 verpakking van 7 eenheden)*

€ 224,85

(excl. BTW)

€ 272,07

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending vanaf 06 april 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en)
Per verpakking
Per stuk*
1 +€ 224,85€ 32,121

*prijsindicatie

RS-stocknr.:
509-961
Fabrikantnummer:
4-146494-0
Fabrikant:
TE Connectivity
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

80

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Tail Pin Length

2.54mm

Contact Gender

Male

Maximum Operating Temperature

125°C

Mating Pin Length

8.38mm

Standards/Approvals

CSA LR7189, UL E28476

Distrelec Product Id

304-50-755

Niet conform

Land van herkomst:
MX
The TE Connectivity PCB Mount Header is designed for vertical mounting and facilitates seamless board-to-board connections, making it ideal for compact applications requiring high-density interconnects. With an impressive 80 positions and a reliable 2.54 mm centreline, this unshrouded header ensures robust connectivity while supporting a variety of electronic configurations. The product's gold-plated contacts enhance conductivity and durability, ensuring excellent performance even in challenging conditions. Crafted from thermoplastic material, it withstands a wide operating temperature range, making it suitable for diverse environments. This header not only meets industry standards but also offers stackable configurations, allowing for versatile installation options in demanding applications.

Unshrouded design optimises space while maintaining connection integrity

Offers a high contact rating of 3 A for enhanced performance

Thermoplastic housing provides excellent durability and heat resistance

Compatible with wave soldering processes, facilitating efficient assembly

Features a copper alloy contact base for improved electrical conductivity

Stackable design enhances flexibility in multi-layered applications

The product is compliant with prominent industry standards for reliable use

Included packaging quantity of 75 ensures sufficient supply for medium-scale projects

Gerelateerde Links