Phoenix Contact MCDN Series Through Hole PCB Header, 8 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

Subtotaal (1 verpakking van 70 eenheden)*

€ 360,59

(excl. BTW)

€ 436,31

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending vanaf 16 februari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en)
Per verpakking
Per stuk*
1 +€ 360,59€ 5,151

*prijsindicatie

RS-stocknr.:
518-645
Fabrikantnummer:
1749544
Fabrikant:
Phoenix Contact
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

Phoenix Contact

Series

MCDN

Product Type

PCB Header

Current

8A

Pitch

3.81mm

Number of Contacts

8

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

COMBICON FMC 1

Contact Plating

Tin over Nickel

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

3.81mm

Minimum Operating Temperature

-40°C

Tail Pin Length

2.6mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Mating Pin Length

2.6mm

Standards/Approvals

cULus Recognised E60425-20110128, DIN EN 61760-1, IEC 60068-2-58, IEC 60068-2-70, IEC 60068-2-82/JEDEC JESD 201, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-3-1, IEC 60512-5-1, IEC 60664-1, ISO 6988, UL 94 V0, VDE 40011723

Voltage

160 V

Land van herkomst:
DE
The Phoenix Contact PCB header represents a ground-breaking step in achieving higher contact density and flexibility in device design. Engineered for integration into surface-mount technology (SMT) soldering processes, this connector is part of the MCDN 1.5/-G1-THR product family. It features a robust construction with a nominal current capability of 8 A and a rated voltage of 160 V. The black housing and tin-plated contacts ensure reliability and compliance with WEEE and RoHS directives. Ideal for applications requiring multiple connection technologies, it offers a user-friendly design that streamlines the assembly process while maintaining excellent electrical performance and environmental resilience. Its compact dimensions make it perfect for modern electronic devices, where space is often at a premium.

Designed to accommodate varying connection technologies with ease

Facilitates a high degree of flexibility in overall device design

Ensures effective integration into automated soldering methods

Exhibits exceptional endurance with a moisture sensitivity level of MSL 1

Promotes efficient utilisation of space through its compact pin layout

Complies with stringent environmental standards for safer use

Easy handling and installation due to its intuitive design

Provides long-lasting performance in extreme temperature conditions

Gerelateerde Links