Phoenix Contact MCDN Series Wave Soldering Mount PCB Header, 20 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

Bekijk alle PCB Headers

Subtotaal (1 verpakking van 130 eenheden)*

€ 218,52

(excl. BTW)

€ 264,41

(incl. BTW)

Add to Basket
selecteer of typ hoeveelheid
Tijdelijk niet op voorraad
  • Verzending vanaf 11 februari 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en)
Per verpakking
Per stuk*
1 +€ 218,52€ 1,681

*prijsindicatie

RS-stocknr.:
558-031
Fabrikantnummer:
1749528
Fabrikant:
Phoenix Contact
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren

Merk

Phoenix Contact

Series

MCDN

Product Type

PCB Header

Pitch

3.81mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

20

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Contact Plating

Nickel, Tin

Row Pitch

3.81mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

100°C

Contact Gender

Male

Tail Pin Length

2.6mm

Mating Pin Length

2.6mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Voltage

160 V

Land van herkomst:
DE
The Phoenix Contact PCB header is meticulously designed for seamless integration into the SMT soldering processes, ensuring reliability and efficiency in electronic connections. This component boasts a flexible design that accommodates various connection technologies, allowing for greater versatility in device architecture. With a robust construction featuring a nominal current of 8 A and a rated voltage of 160 V, it provides dependable performance across multiple applications. The through-hole reflow technology enhances assembly precision, while the compact dimensions ensure ease of installation without compromising on quality. This product is an ideal solution for engineers seeking to optimise space and contact density in their designs.

Integrates effortlessly with SMT soldering processes for enhanced efficiency

Offers flexibility for various connection technologies in device design

Enables high contact density through multi-level conductor connections

Presents a compact footprint, allowing for space-efficient applications

Manufactured from high-quality materials ensuring durability and reliability

Complies with WEEE/RoHS for environmentally-friendly operation

Designed for effective thermal management during the soldering process

Tested for a wide temperature range, suitable for diverse operational environments

Features multiple rows and potential connections for versatile circuit options

Gerelateerde Links